Inside AT&S and the race to make the critical layer beneath AI chips

Austrian technology company AT&S makes a little-known but increasingly important part of AI chips: IC substrates. These high-tech base layers sit beneath processors and memory, helping carry power and data between components inside advanced chip packages. Managing Asia goes inside AT&S's manufacturing complex in Kulim, Malaysia, where the company is expanding capacity as demand grows. CEO Michael Mertin discusses the technology race, AT&S's expansion plans, competition in the substrate market and how geopolitics is reshaping the semiconductor supply chain. Watch the interview on " Managing Asia with Christine Tan " in the video above.